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Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) [Hardcover] Lau, John and Lee, Ricky by Jaffrey, Madhur, 2001
Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) [Hardcover] Lau, John and Lee, Ricky by Jaffrey, Madhur, 2001
Authors
Jaffrey, Madhur
Publisher
Mcgraw-Hill Educatio
Publication Year
2001
Language
English
Binding
Hardcover
ISBN
9780071363273
Pages
450 pages
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