Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) [Hardcover] Lau, John and Lee, Ricky by Jaffrey, Madhur, 2001

Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) [Hardcover] Lau, John and Lee, Ricky by Jaffrey, Madhur, 2001

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Authors Jaffrey, Madhur
Publisher Mcgraw-Hill Educatio
Publication Year 2001
Language English
Binding Hardcover
ISBN 9780071363273
Pages 450 pages
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